Electronic Packaging & Manufacturing Course | IIT Kharagpur | Prof. Anandaroop Bhattacharya
Course Details
| Exam Registration | 131 |
|---|---|
| Course Status | Ongoing |
| Course Type | Elective |
| Language | English |
| Duration | 8 weeks |
| Categories | Mechanical Engineering |
| Credit Points | 2 |
| Level | Undergraduate/Postgraduate |
| Start Date | 19 Jan 2026 |
| End Date | 13 Mar 2026 |
| Enrollment Ends | 02 Feb 2026 |
| Exam Registration Ends | 16 Feb 2026 |
| Exam Date | 29 Mar 2026 IST |
| NCrF Level | 4.5 — 8.0 |
Why Electronic Packaging is the Unsung Hero of Modern Technology
In an era where electronics are embedded in everything from smartphones to satellites, the performance and reliability of these systems hinge on a critical, yet often overlooked, discipline: Electronic Packaging and Manufacturing. It's not just about the silicon chip; it's about how we protect, power, cool, and connect it to the real world. This field is the bridge between groundbreaking semiconductor innovation and the robust, functional devices we use daily.
Recognizing this vital need, the Indian Institute of Technology (IIT) Kharagpur offers a comprehensive 8-week course designed to build foundational expertise. Led by professors with deep industry roots, this course demystifies the complex ecosystem that transforms a microscopic chip into a reliable product.
Meet Your Guides: Professors with Industry Pedigree
The course is enriched by the unparalleled experience of its instructors, who blend academic rigor with real-world application.
Prof. Anandaroop Bhattacharya
An Associate Professor in Mechanical Engineering at IIT Kharagpur, Prof. Bhattacharya brings 12 years of industry experience from giants like Intel, General Motors, and GE Global Research. His expertise in electronics cooling and thermal management is backed by 19 US patent filings and nearly 45 publications. As an Associate Editor for the IEEE Transactions on Components and Packaging Technologies, he is at the forefront of packaging research.
Prof. Goutam Chakraborty
Associate Professor in the Department of Mechanical Engineering at IIT Kharagpur, Prof. Chakraborty complements the instruction with his academic and research prowess, ensuring a well-rounded perspective on the mechanical and manufacturing principles essential to the field.
Course Overview: What You Will Learn
This 8-week program, pitched at Undergraduate and Postgraduate levels, systematically unravels the multi-layered world of electronic packaging.
| Week | Core Topics Covered |
|---|---|
| Week 1 | Introduction, Levels of Packaging, Wafer Fabrication |
| Week 2 | First-Level Packaging (Chip to Carrier): Flip-Chip, Wire Bonding |
| Week 3 | Second-Level Packaging: PCB Design & Manufacturing |
| Week 4 | Third-Level & System Integration: Connectors, Chassis |
| Week 5 | Advanced Packaging: 3D ICs, System-in-Package (SiP), MEMS |
| Week 6 | Mechanical Design: Vibration, Fatigue, and Creep Analysis |
| Week 7 | Thermal Design: Heat Sinks, Thermal Interface Materials, Cooling |
| Week 8 | Reliability Engineering: Failure Analysis, Lifecycle Testing |
Who Should Take This Course & Industry Relevance
This course is meticulously designed for students and professionals aiming to master the physical realization of electronic systems.
- Intended Audience: Students of Mechanical, Electrical, Electronics, and Chemical Engineering.
- Prerequisites: None, though a basic understanding of electronics, solid mechanics, and heat transfer is beneficial.
- Industry Support: The curriculum is highly valued by global leaders including Intel, IBM, Dell, Cisco, GE, Bosch, HP, Qualcomm, and HAL. This endorsement underscores the course's direct relevance to current industry challenges and career opportunities in R&D, product design, and manufacturing.
Key Learning Outcomes: Beyond the Textbook
By completing this course, you will gain:
- A holistic view of the electronic packaging hierarchy, from the chip to the final system.
- Practical knowledge of manufacturing processes like PCB lamination and solder mask application.
- The ability to perform essential mechanical (vibration, fatigue) and thermal analyses to ensure product durability.
- Insights into cutting-edge trends like flexible electronics and packaging for harsh environments.
- A strong foundation in reliability assessment methods, crucial for designing long-lasting products.
Conclusion: Building the Future, One Package at a Time
As devices become faster, smaller, and more pervasive, the role of the packaging and manufacturing engineer becomes increasingly strategic. This IIT Kharagpur course, steered by professors like Anandaroop Bhattacharya with firsthand industry experience, provides the essential toolkit to excel in this domain. It moves beyond circuit theory to answer the critical questions of how to build, protect, and cool electronic systems effectively. For any engineer aspiring to contribute to the next generation of electronics—from consumer gadgets to defense systems—this knowledge is not just useful; it is indispensable.
Enroll Now →